Snapdragon 670 Specification Leaked
Snapdragon 670 is in line to make its debut this coming MWC 2018. Qualcomm hasn’t actually announced this chip yet, however the detail of specification of this new chipset has been leaked.
According to the report of WinFuture, the Snapdragon 670 will be built on the 10nm process, putting it on the same hardware level as the much more efficient higher-end CPUs like the Snapdragon 835 or the Exynos 8895.
The structure of Snapdragon 670 is based on a modified Cortex A55 cluster with six high-efficiency cores dubbed Kryo 300 Silver and the higher performance cluster will comprise of two Cortex A75 cores and will be called Kryo 300 Gold. The Kryo 300 silver is clocked to 1.7GHz while the Kryo 300 Gold is clocked will top 2.6 GHz. Each cluster will have 32Kb of L1 cache, 128Kb of L2 Cache, and 1024Kb of L3 cache altogether. In term of performance, Snapdragon 625 is expected to come close between the Snapdragon 845 and the Snapdragon 660.
For graphic performance, Snapdragon 670 will pair with Adreno 615 and operate between 430 and 650 MHz with a 700 MHz turbo mode for intensive graphic sessions. The GPU will support dual camera. It is designed for camera of a 13MP + 23MP setup.
The chip will feature Qualcomm’s X2x modem that apable of pulling up to 1Gbps (theoretical) speeds. The chip should also support UFS memory and the older eMMC 5.1 flash standard.
The Snapdragon 670 was rumored to start appearing in hardware in the first half of the year.